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Signal Integrity Issues and Printed Circuit Board Design Douglas Brooks
Publisher: Prentice Hall International

But using multiple FPGA implies multichip design and there are several issues which need to be taken care. The FPGA I/O design and placement of FPGA on PCB. But due to tremendous evolution of power densities in transistors, PCB thermal management has now become a serious issue that must be considered early in the design. Several of these issues can be . Here's some ideas to help keep your boards cool and to let them be designed to operate at their highest specifications. PCB design is mostly about signal integrity, controlled impedance lines, EM coupling, and supply decoupling. High density interconnect on PCB and packaging designs with signal switch rates over 5 Gpbs require model characterizations that can support frequency ranges from DC up to THz. By simultaneous I/O design planning and FPGA placement by both the teams important objectives like meeting of overall timing (both FPGA in-chip and on board), meeting of PCB signal integrity constraints, less number of PCB layers and less PCB area can be achieved. Choose semiconductors with the best specifications for both electrical and thermal. Solution 2D Full Wave field solver (EMS2D) provides the full -frequency range analysis from DC, through the middle frequency range which covers the skin effect, to the THz range of the electromagnetic interactions which address resonances, radiations and EM signal integrity issues. PCB thermal management has traditionally been seen as secondary to signal integrity. I don't know of a good reference that addresses all the issues.